AOI - After Solder Mask
Final AOI scan verifies solder mask coverage, pad alignment & legend quality after all processing. Last automated gate before electrical test.
Final AOI scan verifies solder mask coverage, pad alignment & legend quality after all processing. Last automated gate before electrical test.
At Superb Automation, we don't treat quality control as a checkbox at the end of the production line. It is built into every stage — from the moment solder paste touches a bare board, to the final visual check before the finished assembly goes into i
IPC-A-600 defines visual acceptance criteria for bare printed circuit boards — the standard our incoming QC team uses to inspect every PCB before assembly. Covers lamination, plating, solder mask, and dimensional defects.
S8080 3D Solder Paste Inspection (SPI). Measures volume, height, and area on every pad before component placement. Catches printing defects early — the cheapest fix in the entire SMT process.
JCX-830 SMT first article inspection system. Compares assembled board against CAD — verifies every component value, polarity, orientation & placement. Catches BOM errors before they become production defects.
Tour Superb Automation's QC laboratory — a 10-station inspection pipeline covering 3D AOI, X-ray CT, Flying Probe ICT, FCT, thermal stress, ionic contamination, and visual final inspection. Every board passes through this lab before shipment.
AOI sees what the eye can see — and does it thousands of times per minute with machine consistency. X-ray sees what AOI cannot: the solder joints hidden beneath BGA, QFN, and CSP packages. This article compares both methods, explains when each is suf